Instructor - Kiris Pister, University of California, Berkeley

4 Semester Credit Hours

Course Description

The course will begin with a summary of integrated circuit fabrication technologies leading into an overview of the technologies available to shape electromechanical elements on a submillimeter scale. Physics of MEMS devices will be covered at a level necessary to design and analyze new devices and systems. Several commercially available MEMS processes will be discussed in detail, and students will design final projects in these processes.

Prerequisities

A solid background in engineering or physics.

Objectives

The objective of the course is to provide each student a strong foundation in the design, fabrication, and analysis of micro-electromechanical devices. At the completion of the course, student should be able to make reasonable decisions about the fabrication options and performance of new MEMS devices and systems.

Course Topics

• Basic fabrication techniques: lithography, thin film deposition, chemical and plasma etching, anisotropic silicon etching
• Device physics: beam theory, electrostatic actuation, capacitive and piezoresistive sensing, thermal sensors and actuators
• Standard processes: 2 layer polysilicon, CMOS, DRIE. Electronic interfacing, mechanical and electrical noise, fundamental limits
• AD tools: layout, process simulation, PDE and ODE solvers, synthesis.

No textbook required

Disclaimer: Textbook information is provided only to give more information about the course.  Do Not use this information to purchase a textbook.  Up-to-date information will be provided when you register.